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Issue DateTitleAuthor(s)
2022Thermal conductance at Sn‐0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth.Oliveira Junior, Ricardo; Cruz, Clarissa Barros da; Barros, André dos Santos; Bertelli, Felipe; Spinelli, José Eduardo; Garcia, Amauri; Cheung, Noé
2021Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead- free alloy solidified against Cu, Ni and low-C steel substrates.Lima, Thiago Soares; Cruz, Clarissa Barros da; Xavier, Marcella Gautê Cavalcante; Reyes, Rodrigo André Valenzuela; Bertelli, Felipe; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé