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Issue DateTitleAuthor(s)
2020Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples.Lima, Thiago Soares; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher Cardoso de; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé