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| Issue Date | Title | Author(s) |
|---|---|---|
| 2020 | Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples. | Lima, Thiago Soares; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher Cardoso de; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé |
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- 1 2020