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Issue DateTitleAuthor(s)
2022Thermal conductance at Sn‐0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth.Oliveira Junior, Ricardo; Cruz, Clarissa Barros da; Barros, André dos Santos; Bertelli, Felipe; Spinelli, José Eduardo; Garcia, Amauri; Cheung, Noé
2021Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead- free alloy solidified against Cu, Ni and low-C steel substrates.Lima, Thiago Soares; Cruz, Clarissa Barros da; Xavier, Marcella Gautê Cavalcante; Reyes, Rodrigo André Valenzuela; Bertelli, Felipe; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé
2020Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples.Lima, Thiago Soares; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher Cardoso de; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé
2021Interface evaluation of a Bi–Zn eutectic solder alloy : effects of different substrate materials on thermal contact conductance.Azeredo, Rudimylla Septimio; Cruz, Clarissa Barros da; Xavier, Marcella Gautê Cavalcante; Lima, Thiago Soares; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé
2021Microstructural and segregation efects afecting the corrosion behavior of a high‐temperature Bi‐Ag solder alloy in dilute chloride solution.Azeredo, Rudimylla Septimio; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Garcia, Amauri; Spinelli, José Eduardo; Cheung, Noé