Navegando por Autor "Lima, Thiago Soares"
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Item Effect of microstructure features on the corrosion behavior of the Sn‐2.1 wt%Mg solder alloy.(2020) Cruz, Clarissa Barros da; Lima, Thiago Soares; Soares, Marco César Prado; Feitosa, Emmanuelle Sá Freitas; Fujiwara, Eric; Garcia, Amauri; Cheung, NoéThe Sn–Mg eutectic alloy is a potential replacement for the traditional Sn-38.1 wt%Pb solder alloy, since lead has been banned because of its risk to human health and the environment. However, studies in the literature related to the Sn-2.1 wt%Mg alloy are restricted to mechanical, electrical and thermal properties. Therefore, this study aims to evaluate the corrosion behavior of this alloy, as a function of the microstructural arrangement obtained from directional solidifcation performed in a transient heat extraction regime. The thermal solidifcation parameters (solidifcation growth rate and cooling rate) were determined along the length of the casting for correlations with microstructural features. The resulting microstructure was characterized by scanning electron microscopy, energy-dispersive X-ray spectroscopy and X-ray difraction. Subsequently, the electrochemical impedance spectroscopy, linear polarization, equivalent circuit and evolution of hydrogen release analyzes were performed to evaluate the corrosion behavior of the samples in a 0.5 M NaCl solution at 25 °C. Interphase spacing and Mg2Sn fraction were found to infuence the corrosion behavior, showing higher corrosion resistance for a more refned microstructure.Item Interface evaluation of a Bi–Zn eutectic solder alloy : effects of different substrate materials on thermal contact conductance.(2021) Azeredo, Rudimylla Septimio; Cruz, Clarissa Barros da; Xavier, Marcella Gautê Cavalcante; Lima, Thiago Soares; Garcia, Amauri; Spinelli, José Eduardo; Cheung, NoéIndustry is searching for ways of improving the process control required for the manufacture of electronic circuitry. In this respect, a numerical mathematical model for thermal contact conductance of solder/substrate couples is developed based on an inverse heat conduction problem. The intention of this research is combining the model results and wetting experiments in order to determine if there is a compromise between them in the matter of the Bi–Zn eutectic alloy. Substrate materials considered as priority for the electronics industry were tested. It was found that the heat transfer coefficients (h) and the contact angles (θ) might be related to each other. The Bi–Zn/copper, Bi–Zn/nickel, Bi–Zn/Invar and Bi–Zn/steel couples, in this order, generated θ varying from the smallest to the largest as well as h from the largest to the smallest. Microstructural coarsening effect has been realized with higher spacing between Zn fibers (λZn) referring to a condition of worse heat extraction imposed by an alloy/substrate couple during solidification.Item Interfacial heat transfer and microstructural analyses of a Bi- 5% Sb lead- free alloy solidified against Cu, Ni and low-C steel substrates.(2021) Lima, Thiago Soares; Cruz, Clarissa Barros da; Xavier, Marcella Gautê Cavalcante; Reyes, Rodrigo André Valenzuela; Bertelli, Felipe; Garcia, Amauri; Spinelli, José Eduardo; Cheung, NoéBi-Sb system alloys demonstrate high corrosion resistance and good wettability, becoming promising for use as lead-free solder alloys. The simplicity of the phase diagram is also a characteristic of this system, which is isomorphous forming the (Bi,Sb) phase. While extensive research has been performed on heat flow in couples of microelectronics surfaces with eutectic and peritectic alloys, literature regarding the issues of interfacial heat transfer between isomorphous alloys and microelectronics substrates is nonexistent. In this regard, the present research work demonstrates not only the application of a numerical mathematical model for thermal interface conductance but also wetting and interfacial reaction layer results in the formation of phases for the Bi- 5 wt% Sb alloy in different substrate materials. After carrying out the mentioned analyzes in three different conditions, Bi-Sb/copper, Bi-Sb/nickel and Bi-Sb/low-C steel, the wetting angle is shown not to be the predominant factor in controlling the interfacial heat transfer. Instead, the phases forming the interfacial layer from each of the tested substrates have a role in the heat transfer coefficients (h). In the case of the steel substrate, there is no layer formation, which allows greater contact conductance, whereas Bi-Sb/copper and Bi-Sb/nickel couples generate smaller h, being reasonably similar to each other.Item Interplay of wettability, interfacial reaction and interfacial thermal conductance in Sn-0.7Cu solder alloy/substrate couples.(2020) Lima, Thiago Soares; Cruz, Clarissa Barros da; Silva, Bismarck Luiz; Brito, Crystopher Cardoso de; Garcia, Amauri; Spinelli, José Eduardo; Cheung, NoéDirectional solidification experiments coupled with mathematical modelling, drop shape analyses and evaluation of the reaction layers were performed for three different types of joints produced with the Sn-0.7 wt.%Cu solder alloy. The association of such findings allowed understanding the mechanisms affecting the heat transfer efficiency between this alloy and substrates of interest. Nickel (Ni) and copper (Cu) were tested since they are considered work piece materials of importance in electronic soldering. Moreover, low carbon steel was tested as a matter of comparison. For each tested case, wetting angles, integrity and nature of the interfaces and transient heat transfer coefficients, ‘h’, were determined. Even though the copper has a thermal conductivity greater than nickel, it is demonstrated that the occurrence of voids at the copper interface during alloy soldering may decrease the heat transfer efficiency, i.e., ‘h’. Oppositely, a more stable and less defective reaction layer was formed for the alloy/nickel couple. This is due to the sup-pression of the undesirable thermal contraction since the hexagonal Cu6Sn5 intermetallics is stable at temperatures below 186C in the presence of nickel.Item Microstructure growth morphologies, macrosegregation, and microhardness in Bi–Sb thermal interface alloys.(2020) Lima, Thiago Soares; Cruz, Clarissa Barros da; Barros, André dos Santos; Garcia, Amauri; Cheung, NoéDue to the rising demand for thermal management technologies within the electronics industry, there has been an increased emphasis on developing new thermal interface materials (TIMs) with enhanced performance. Despite Bi-based alloys having exhibited promising potential as TIMs in microelectronics cooling applications, understanding the microstructure evolution of these alloys and the consequent effects on the resulting properties still remains an essential task to be accomplished. Herein, a directional solidification technique is used to investigate microstructural features and Vickers microhardness of Bi(5–20) wt% Sb alloys with a focus on the roles of alloy composition, solidification thermal parameters, and macrosegregation. The results show the formation of aligned Bi-rich den-drites in a broad range of cooling rates from about 0.2 to 25 C s1. In contrast, as the alloy Sb content increases, two morphological transitions in the Bi-rich matrix are shown to occur as follows: trigonal pattern ! irregular shape ! trigonal pattern. Then, primary and secondary dendritic arm spacings are related to growth and cooling rates through experimental equations. Finally, the occurrence of macrosegregation along the length of the Bi–20 wt% Sb alloy casting is shown to be a key factor associated with the variation of microhardness.Item Plate-like growth in a eutectic Bi–Ni alloy : effects of morphological microstructure evolution and Bi3Ni intermetallic phase on tensile properties.(2020) Cruz, Clarissa Barros da; Lima, Thiago Soares; Kakitani, Rafael; Barros, André dos Santos; Garcia, Amauri; Cheung, NoéThe development of efficient thermal interface materials (TIMs) has become an emerging demand mainly driven by the continual rise in power dissipation of high-performance microprocessors. In this context, Bi-based alloys are among the promising types of TIMs for electronic packaging applications. However, the influence of the microstructural arrangement on mechanical strength of Bi–Ni alloys remains barely understood. To overcome this issue, this study aims to develop quantitative microstructure features-tensile properties correlations for a Bi–0.28 wt.%Ni alloy solidified in a wide range of cooling rates (T). ̇ In addition to the phase diagram calculated by the Thermo-Calc software (SSOL6 database) and differential scanning calorimetry analysis, the characterization of the Bi3Ni intermetallic compound is carried out using X-ray diffraction and SEM microscopy with energy disper- sive X-ray spectroscopy. Wavy instabilities in the plate-like morphology of the Bi matrix are shown to occur for T ̇ ≤ 0.13 ◦C/s. Besides that, more significant variations in yield and ultimate tensile strengths, y and u, respectively, are associated with a certain range of microstructural spacings between Bi plates () from 47.6 to 135.2m. Hence, Hall–Petch type relations are proposed to describe the variation of both y and u as a function of .